Short Courses and Conferences

2014 IEEE Conference on Reliability Science for Advanced Materials and Devices

Institute of Electrical and Electronics Engineers

September 7 - 9, 2014

Call for Papers

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Papers are being solicited for presentation at the conference. Submission deadline for abstracts is July 27, 2014. More information is available in either PDF or HTML format.

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Student Awards

RSAMD student awards are intended to honor and encourage students' (both undergraduate and graduate) involvement and exposure to the field of reliability science. Learn more...

Submission Method and Format

The deadline for submission of abstracts for presentations and posters is July 27, 2014. Abstracts must be submitted electronically as a computer file in Microsoft Word ".doc" or Adobe ".pdf" format. To submit your abstract, point your Internet browser to:

To begin your submission, enter your email address and you will be directed to the submissions database. An email, containing your access credentials, will be sent to you.

Step by step instructions on submitting an abstract can be found here:

Abstract Submission Instructions

Abstract Format

A maximum of two pages will be accepted for the abstract. It is permissible to integrate graphics and figures with text, or use the second page for support data. Abstracts must be submitted with supporting data or they will not be accepted. Note abstracts must also include suggested conference topic area, and five keywords describing the submission.

The template for abstracts is available here:

Abstract Template

Conference Topic Areas:

  1. Degradation Mechanisms in Use Environments
  2. Photovoltaics and Renewables
  3. Pb-Free Solder Reliability
  4. Wide-Bandgap (WBG) Semiconductors
  5. Advanced Microelectronic Technologies

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